It　is　well　known　that　microcracking　in　brittle　materials　results　in　a　reduction　of　the　stress　intensity　factor　(SIF)　and　energy　release　rate　(ERR).　The　reduced　SIF　or　ERR　represents　crack　tip　shielding　which　is　of　significant　interest:　to　micromechanics　and　material　science　researchers.　However,　the　effect　of　microcracking　on　the　SIF　and　ERR　is　a　complicated　subject　even　for　isotropic　homogeneous　materials,　and　becomes　much　more　formidable　in　case　of　interface　cracks　in　bonded　dissimilar　solids.　To　unravel　the　micromechanics　of　interface　crack　tip　shielding　in　bonded　dissimilar　anisotropic　solids,　an　interface　crack　interacting　with　arbitrarily　oriented　subinterface　microcracks　in　bonded　dissimilar　anisotropic　materials　is　studied.　After　deducing　the　fundamental　solutions　for　a　subinterface　crack　under　concentrated　normal　and　tangential　tractions,　the　present　interaction　problem　is　reduced　to　a　system　of　integral　equations　which　is　then　solved　numerically.　A　J-integral　analysis　is　then　performed　with　special　attention　focused　on　the　J(2)-integral　in　a　local　coordinate　system　attached　to　the　microcracks.　Theoretical　and　numerical　results　reassert　the　conservation　law　of　the　J-integral　derived　for　isotropic　materials(1.2)　also　to　be　valid　for　bonded　dissimilar　anisotropic　materials.　It　is　further　concluded　that　there　is　a　wastage　when　the　remote　J-integral　transmits　across　the　microcracking　zone　from　infinity　to　the　interface　macrocrack　tip.　In　order　to　highlight　the　influence　of　microstructure　on　the　interracial　crack　tip　stress　field,　the　crack　tip　SIF　and　ERR　in　several　typical　cases　are　presented.　It　is　interesting　to　note　that　the　Mode　I　SIF　at　the　interface　crack　tip　is　quite　different　from　the　ERR　in　bonded　dissimilar　anisotropic　materials.