Numerical　simulation　technique　is　used　to　investigate　the　effects　of　a　compound　angle　(30°,　45°　or　60°)　on　the　film　cooling　performance　based　on　a　trench-shaped　hole　geometry.　From　the　film　cooling　efficiency　and　velocity　distribution,　the　results　indicate　that　the　compound　angle　can　improve　the　lateral　coverage　of　cooling　film　over　a　hot　surface.　Moreover,　with　the　increase　of　the　compound　angle,　the　cooling　film　shows　considerable　uniform　cover　and　better　cooling　performance,　especially　at　a　high　blowing　ratio.