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Author:

Ren, Kai (Ren, Kai.) | Qin, Huasong (Qin, Huasong.) | Liu, Huichao (Liu, Huichao.) | Chen, Yan (Chen, Yan.) | Liu, Xiangjun (Liu, Xiangjun.) | Zhang, Gang (Zhang, Gang.)

Indexed by:

SCIE EI Scopus Web of Science

Abstract:

2D Janus transition metal dichalcogenide (TMD) semiconductor materials have attracted great interest for their potential applications. Because of the increased requirement for thermal management in 2D devices with single-atom thickness, a fundamental understanding of interfacial thermal conduction (ITC) has emerging significance. In this work, the ITC of in-plane heterostructures constructed using MoSSe and WSSe is reported. In addition to the interface connected normally by MoSSe and WSSe with the same type of chalcogen atoms are on the same side of left and right sections, inversional interface by rotation of 180 degrees of WSSe is also considered, in which S atoms are on the opposite side of the left and right sections. Interestingly, the ITC in the normally connected heterostructure is found to be almost twice as much as that in the inversely connected heterostructure. The unusually large change in ITC is attributed to the bending curvature and additional discontinuity in the inversely connected heterostructure. Euler-Bernoulli beam model gives further insight into the origin of such interface bending. The findings offer the very first insight into the phonon transport in Janus heterostructures, and benefit thermal management of 2D devices based on Janus monolayers.

Keyword:

2D materials interfacial thermal conductance Janus heterostructures thermal conduction thermo-mechanical coupling

Author Community:

  • [ 1 ] [Ren, Kai]Nanjing Forestry Univ, Sch Mech & Elect Engn, Nanjing 210042, Jiangsu, Peoples R China
  • [ 2 ] [Qin, Huasong]Xi An Jiao Tong Univ, Sch Aerosp, Lab Multiscale Mech & Med Sci, SV LAB, Xian 710049, Peoples R China
  • [ 3 ] [Liu, Huichao]Xi An Jiao Tong Univ, Sch Aerosp, Lab Multiscale Mech & Med Sci, SV LAB, Xian 710049, Peoples R China
  • [ 4 ] [Chen, Yan]Xi An Jiao Tong Univ, Sch Aerosp, Lab Multiscale Mech & Med Sci, SV LAB, Xian 710049, Peoples R China
  • [ 5 ] [Liu, Xiangjun]Donghua Univ, Inst Micro Nano Electromech Syst, Coll Mech Engn, Shanghai 201620, Peoples R China
  • [ 6 ] [Zhang, Gang]ASTAR, Inst High Performance Comp, Singapore 138632, Singapore

Reprint Author's Address:

  • H. Qin;;Laboratory for Multiscale Mechanics and Medical Science, SV LAB, School of Aerospace, Xi'an Jiaotong University, Xi'an, 710049, China;;email: huasongqin@xjtu.edu.cn;;G. Zhang;;Institute of High Performance Computing, A*STAR, Singapore, 138632, Singapore;;email: zhangg@ihpc.a-star.edu.sg;;

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Source :

ADVANCED FUNCTIONAL MATERIALS

ISSN: 1616-301X

Year: 2022

Issue: 18

Volume: 32

1 8 . 8 0 8

JCR@2020

ESI Discipline: MATERIALS SCIENCE;

ESI HC Threshold:7

Cited Count:

WoS CC Cited Count: 17

SCOPUS Cited Count: 57

ESI Highly Cited Papers on the List: 3 Unfold All

  • 2022-11
  • 2022-9
  • 2022-7

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 2

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