Achieving　an　excellent　combination　of　mechanical　properties　and　electrical　conductivity　in　conductive　copper　alloys　is　highly　desirable　but　remains　a　great　challenge.　This　paper　reports　a　dual　heterogeneous　laminated　(DHLed)　Cu/Cu-Cr-Zr　composite　structure　in　copper　alloys　produced　by　accumulative　roll　bonding　(ARB)　and　annealing　process　that　can　produce　an　excellent　property　combination:　high　strength　(ultimate　tensile　strength:　563.4　±　14　MPa),　sufficient　tensile　ductility　(uniform　elongation:　~16.2%),　and　high　conductivity　(~92%IACS).　The　specially　designed　DHLed　Cu/Cu-Cr-Zr　composite　microstructure　is　characterized　by　alternating　coarse-　and　ultra-fine　grain　layers　and　layered　distribution　of　precipitations.　Such　dramatic　microstructure　heterogeneities　produce　significant　hetero-deformation　induced　hardening　due　to　mechanical　incompatibility　between　soft　Cu　and　hard　Cu-Cr-Zr　layers,　which　leads　to　an　excellent　combination　of　strength　and　ductility.　The　high　conductivity　can　be　attributed　to　the　unique　DHLed　Cu/Cu-Cr-Zr　composite　structure　containing　alternating　recrystallized-　and　nanolaminated-grain　layers.　©　2022　Elsevier　Inc.