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Author:

Wang, Jian (Wang, Jian.) | Lei, Zixuan (Lei, Zixuan.) | Yao, Jiayu (Yao, Jiayu.) | Li, Jian (Li, Jian.) | Liu, Yuhong (Liu, Yuhong.)

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Abstract:

Due to the detriment and non-renewable of formaldehyde in phenolic resin, a novel phenolic resin, terephthalaldehyde phenolic thermosets, was synthesized by using a safe and renewable terephthalaldehyde instead of formaldehyde. NMR, IR, GPC and rheometer were utilized to explore the structure and properties of the resin. To further improve the thermal properties of the resin, ferrocenecarboxaldehyde was choosed to modify the resin. The curing mechanism of the modified resin was systematically clarified according to the curing kinetics of resin by Kissinger, isoconversion and autocatalytic kinetic model. Finally, the thermal properties of the cured resin were studied by MDSC and TG. When adding 15% ferrocenecarboxaldehyde, the modified resin presents excellent thermal properties whose glass transition temperature and initial decomposition temperature was 319.3 and 397.7 respectively, and the weight retention rate was as high as 76.07% under 800 nitrogen atmosphere. © 2022, Editorial Board of CIESC Journal. All right reserved.

Keyword:

Activation energy Curing Formaldehyde Glass transition Kinetics Phenolic resins Synthetic resins Thermodynamic properties

Author Community:

  • [ 1 ] [Wang, Jian]Institute of Chemical Engineering and Technology, Xi'an Jiaotong University, Xi'an; 712000, China
  • [ 2 ] [Lei, Zixuan]Institute of Chemical Engineering and Technology, Xi'an Jiaotong University, Xi'an; 712000, China
  • [ 3 ] [Yao, Jiayu]Institute of Chemical Engineering and Technology, Xi'an Jiaotong University, Xi'an; 712000, China
  • [ 4 ] [Li, Jian]Xi'an Aerospace Composite Materials Research Institute, Xi'an; 710038, China
  • [ 5 ] [Liu, Yuhong]Institute of Chemical Engineering and Technology, Xi'an Jiaotong University, Xi'an; 712000, China

Reprint Author's Address:

  • Y. Liu;;Institute of Chemical Engineering and Technology, Xi'an Jiaotong University, Xi'an, 712000, China;;email: liuyuh@xjtu.edu.cn;;

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Source :

CIESC Journal

ISSN: 0438-1157

Year: 2022

Issue: 3

Volume: 73

Page: 1403-1415

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count: 4

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 3

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